ARCTIC MX-6 2g Thermal Paste
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Cash on delivery and various payment options and installment plans.
Fast and Secure Shipping
Receive your order within 2 to 5 business days.
Customer Service
Technical support from 10 am to 12 pm.
Warranty Coverage
Enjoy a 6-month to 3-year warranty through us with distributors.
Flagship Thermal Conductivity with 20% Lower Resistance & Anti-Pump-Out Viscosity
20% Lower Thermal Resistance • Anti-Pump-Out High Viscosity • 2g Resealable Syringe • 100% Non-Conductive
Extreme Overclockers & High-Density Direct-Die Silicon
Engineered with specialized carbon fillers that reduce thermal resistance (Rθ) by 20% compared to previous generations. Delivers outstanding thermal conductivity across modern chiplet architectures with concentrated multi-core heat flux.
Gaming Laptops, Bare-Die GPUs & Console Long-Term Repasting
Featuring an optimized high-viscosity consistency, MX-6 prevents the notorious 'pump-out effect' caused by thermal expansion cycles in direct-die cooling (laptops, PS5, Xbox, graphics cards), ensuring sustained performance without paste migration.
20% Lower Thermal Resistance (Rθ)
The innovative carbon filler matrix significantly reduces thermal boundary resistance between the processor die and cooling base, dropping load temperatures noticeably compared to MX-4.
High Viscosity Consistency for Direct-Die Cooling
Engineered thicker than MX-4 to resist the pump-out effect commonly seen on bare-die silicon (laptops and graphics cards) subjected to rapid thermal cycling.
Engineered for CPUs, GPUs, Laptops & Consoles
Versatile formulation delivers optimal heat transfer across desktop CPUs (LGA1851/1700, AM5), graphics cards (RTX 40/50), gaming laptops, and game consoles (PS5/Xbox).
Authenticity Verification QR Code on Every Box
Each retail box features ARCTIC's official Authenticity Check QR code to guarantee genuine German-formulated compound backed by full factory warranties.
Next-Gen Thermal Dissipation & Temperature Reduction Index
Peak core temperature under sustained AIDA64 / Cinebench R23 multi-core stress test (°C lower is better)
Detailed Hardware Specifications
| Product Name | ARCTIC MX-6 Ultimate Performance Thermal Compound |
| Net Quantity | 2 Grams (Resealable Syringe) |
| Active Matrix | Optimized Carbon Micro-Particle Formulation |
| Thermal Resistance (Rθ) | 20% Lower than ARCTIC MX-4 |
| Viscosity | 45,000 Poise (High Viscosity Anti-Pump-Out Consistency) |
| Density | 2.60 g/cm³ |
| Continuous Use Temperature | -50 °C to +150 °C |
| Volume Resistivity | 1.8 × 10¹² Ω-cm (Dielectric) |
| Breakdown Voltage | 7.5 kV/mm |
| Electrical Safety | 100% Electrically Non-Conductive & Non-Capacitive |
| Curing Time | Zero Curing Time (Immediate Peak Conductivity) |
| Direct-Die Suitability | Optimized for Bare Silicon (Laptops, GPUs, APUs) |
| Typical Applications | Approximately 4 to 6 Desktop CPU or GPU Applications |
| Compatibility | Intel LGA 1851/1700/1200, AMD AM5/AM4, GPUs, Laptops, PS5, Xbox |
| Packaging Type | Protective Box with ARCTIC Authenticity Check QR Code |
| Manufacturer Origin | Engineered in Germany by ARCTIC |
