Cooler Master Thermal Pad Pro 2.0mm
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Cooler Master Thermal Pad Pro 2.0mm
Drastically reduce component temperatures with Cooler Master Thermal Pad Pro 2.0mm, engineered with extreme 15.3 W/mK thermal conductivity, non-electrical conductivity, and high compressibility for seamless gap filling.
Key Engineering & Performance Features
Extreme 15.3 W/mK Thermal Conductivity
Far surpasses standard factory pads to rapidly transfer heat away from boiling GPU GDDR6/GDDR7 VRAM and motherboard VRM power stages.
100% Non-Electrically Conductive Safety
Formulated with pure metal-oxide ceramic fillers that will never cause electrical short circuits even when bridging delicate PCB micro-traces.
Effortless Cut-to-Size Precision
Double-sided protective peel film with standard dimensions allows custom cutting with scissors to fit any M.2 SSD or GPU chip.
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Technical Specifications
| Manufacturer | Cooler Master |
|---|---|
| Model | Thermal Pad Pro 2.0mm (MNX-TASO-9520-R1) |
| Thermal Conductivity | 15.3 W/mK (Extreme Grade) |
| Thickness | 2.0 mm Precision Calibrated |
| Dimensions | 95 x 45 x 2.0 mm Sheet |
| Electrical Conductivity | Zero (Completely Non-Conductive) |
| Operating Temperature | -50°C to +200°C Thermal Stability |
| Hardness & Compressibility | Ultra-Soft Flexible Gap Filling Silicone |
| Target Applications | GPU VRAM, Motherboard VRM, M.2 NVMe SSDs, Laptops |
| Warranty | Official 1-Year Authorized Warranty in Egypt |
