Thermal Grizzly Minus Pad 8 30x30x2.0mm Thermal Pad
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Thermal Grizzly Minus Pad 8 30x30x2.0mm Thermal Pad
The Thermal Grizzly Minus Pad 8 (30 x 30 x 2.0 mm) delivers reliable, high-performance thermal transfer between heat-generating electronics and cooling heatsinks. Convenient compact square pad tailored for targeted single-chip cooling (chipsets, controllers, discrete VRM stages). Designed with non-conductive ceramic-silicone material, it ensures safe, long-lasting cooling without drying out.
Enthusiast Performance & Electrical Reliability
Engineered Ceramic-Silicone Formula
Optimized to bridge component gaps and pull heat rapidly away from delicate silicon packages.
Elastic Mechanical Compliance
Compresses gently to conform to micro-gaps without stressing surface-mounted components or warping boards.
100% Electrically Non-Conductive
Zero electrical conductivity prevents short circuits, ensuring maximum safety across delicate PCBs.
Targeted Application: Chipsets, Network Controllers, and Single ICs
Tailored dimensions and thickness minimize custom cutting, speeding up maintenance and cooler mounting.
Recommended Hardware Synergy
Technical Datasheet
| Manufacturer & Model | Thermal Grizzly Minus Pad 8 (30 x 30 x 2.0 mm) |
|---|---|
| Series Lineup | Minus Pad 8 |
| Dimensions & Format | 30 x 30 x 2.0 mm |
| Packaging | Compact 30x30mm Square |
| Material Composition | Ceramic Silicone Elastomer |
| Electrical Conductivity | 0 pS/m (100% Non-Conductive) |
| Operating Range | -100°C to +250°C |
| Recommended Applications | Chipsets, Network Controllers, and Single ICs |
| Country of Origin | Engineered in Germany |
| Warranty Coverage | Official Thermal Grizzly Authorized Product in Egypt |
