Thermalright TF7 Thermal Paste 2g
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Thermalright TF7 Thermal Paste (2g)
Engineered for high-wattage desktop processors and graphics cards, Thermalright TF7 delivers a massive 12.8 W/(m·K) thermal conductivity. Featuring an advanced sub-micron carbon/metal-oxide matrix without electrical conductivity, TF7 ensures rapid heat transfer, zero curing delay, and reliable performance across extreme temperatures.
Engineered For Extreme Gaming & Thermal Demands
High-TDP Gaming & Overclocking Rigs
Perfect for unlocked Intel K-series and AMD Ryzen 9 processors where high thermal flux demands instant heat transmission into AIO radiators or premium air towers.
GPU Re-Pasting & Direct-Die Cooling
High shear stability and zero electrical conductivity make TF7 the benchmark choice for refreshing thermal paste on gaming graphics cards and enthusiast laptops.
Thermalright TF7 Formula Advantages
12.8 W/(m·K) Extreme Heat Transfer
Dense micro-compound formulation minimizes thermal resistance and bridges microscopic contact irregularities effortlessly.
Cryogenic to High-Heat Stability
Engineered to operate reliably from -220 °C to +380 °C without hardening, curing, or separating over extended thermal cycles.
Precision Spreader Included
Supplied with an ergonomic plastic spatula for uniform, edge-to-edge application without air pockets or compound waste.
100% Non-Conductive Formula
Silicone carrier containing zero metal particles guarantees absolute safety around PCB traces and delicate CPU socket pins.
Technical Specifications
| Manufacturer | Thermalright |
| Model SKU | AHW-AMZ-B0CYJF592B (TF7 2g) |
| Net Content | 2 Gram Syringe |
| Thermal Conductivity | 12.8 W/(m·K) |
| Thermal Impedance | <0.01 °C-in²/W |
| Specific Gravity (Density) | 2.8 g/cm³ |
| Usable Temperature Range | -220 °C to +380 °C |
| Electrical Conductivity | 0 pS/m (100% Non-Conductive) |
| Color | Gray |
| Included Accessories | Specialized Spreader Spatula |
